Henkel Loctite ECCOBOND UF 8807 Epoxy Encapsulant Blue is used to reduce thermal and mechanical stresses between CSP packages and HDI substrates in MPM applications. It offers high flow speed, fast cure at low temperatures, low stress, and superior adhesion after moisture testing. 10 cc Syringe.
Typical Use: | Used to reduce thermal and mechanical stresses between CSP packages and HDI substrates in MPM applications. |
Brand: | ECCOBOND |
Color: | Blue |
Components: | 1 part |
Cure System: | Heat |
Flash Point: | >93 °C |
Specific Gravity: | 1.7 |
Thermal Conductivity: | 0.6 W/mK |
Viscosity: | 13,000 |