ResinLab EP691F Epoxy Encapsulant Part B Clear 1 gal Bottle

Part number: EP691F CLEAR - B GL Manufacturer SKU: EP691F CLEAR B GL
ResinLab EP691F Epoxy Encapsulant Part B Clear 1 gal Bottle

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ResinLab EP691F Clear is a two component, room temperature or heat curing, epoxy encapsulant that is used for medium to large castings and filling voids. It is electronic grade, rigid, free flowing, and has good air release and wetting properties. It is resistant to bases, acids, water, and most organic solvents. Part B, 1 gal Bottle.

<p><span>ResinLab EP691F Clear is a two component, room temperature or heat curing, epoxy encapsulant that is used for medium to large castings and filling voids. It is electronic grade, rigid, free flowing, and has good air release and wetting properties. It is resistant to bases, acids, water, and most organic solvents. Part B, 1 gal Bottle.</span></p>
Typical Use: Designed for medium to large castings.
Chemical Composition: Epoxy
Color: Clear
Components: 2 part
Cure System: Room Temperature/Heat
Cure Time: 24 to 48h @ room temperature; 2h @ 65 °C; 1h @ 100 °C
Dielectric Strength: 550 V/mil
Elongation: 4.5%
Flash Point: 128 °C
Hardness: 80 D
Mix Ratio: 3.13:1 by weight; 2.55:1 by volume
Service Temperature: -40 to 150 °C
Shear Strength: 2,000
Specific Gravity: Part B: 0.95; Mixed: 1.10
Tensile Strength: 8,300 psi
Viscosity: Part B: 10; Mixed: 700
Volume Resistivity: 3.16 x 10^16 ohm-cm
Working Time: 2h

 

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