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Part number: EP691 CLEAR 50ML
For current pricing and to place an order please contact your Ellsworth Customer Service Representative.
ResinLab EP691 Clear is a two component, room temperature or heat curing, unfilled epoxy encapsulant that is used for medium castings, bonding with most materials, and filling voids. It is electronic grade, semi-rigid, free flowing, and has good air release and wetting properties. It is resistant to bases, acids, water, and most organic solvents. 50 mL Cartridge.
| Typical Use: | Designed for medium sized castings requiring good clarity. |
| Chemical Composition: | Epoxy |
| Color: | Clear |
| Components: | 2 part |
| Cure System: | Room Temperature/Heat |
| Cure Time: | 24h @ room temperature; 1h @ 65 °C; 20min @ 100 °C |
| Dielectric Strength: | 410 V/mil |
| Elongation: | 4% to 9% @ break |
| Flash Point: | Part A: 252 °C; Part B: >260 °C |
| Hardness: | 80 D |
| Mix Ratio: | 2:1 by volume; 100:45 by weight |
| Service Temperature: | -40 to 121 °C |
| Specific Gravity: | Mixed: 1.11 |
| Tensile Strength: | 8,500 psi |
| Thermal Conductivity: | 0.14 W/mK |
| Viscosity: | Mixed: 9,000 |
| Volume Resistivity: | 8 x 10^14 ohm-cm |
| Working Time: | >2h |
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Part #: EAD50MS-11/21 -
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