HumiSeal® TS 300 TempSeal Masking Compound is a high temperature, non-flammable, temporary mask that is used to protect and cover circuit boards during conformal coatings. It can be easily peeled, contains no ammonia, and will not prevent thermal cure of silicone coatings. It is applied through dispensing machines, applicator bottles, or brushing methods. 236 mL Bottle.
Typical Use: | TS 300 effectively covers and protects parts and connections where coating is not desired. Contains no ammonia and will not inhibit thermal cure silicone conformal coatings. |
Chemical Composition: | Polymer/water |
Color: | Pink |
Components: | 1 part |
Cure Time: | 60min |
Specific Gravity: | 1.15 |
Viscosity: | Thixotropic |