Dow DOWSIL™ SE 1700 W/C Thermally Conductive Adhesive Clear is a two-part non-flowing, heat cure, and high tensile strength adhesive. It is primarily used for sealing ceramic condensers, sealing PCB components, and as a bonding agent for key pad of PC. 1.1 kg Kit.
Typical Use: | Used for sealing ceramic condensers, sealing PCB components, and as a bonding agent for key pad of PC. |
Brand: | DOWSIL |
Chemical Composition: | Polydimethylsiloxane adhesive |
Color: | Clear |
Components: | 2 part |
Cure System: | Heat |
Cure Time: | 30min @ 150 °C |
Elongation: | 355% |
Hardness: | 48 A |
Mix Ratio: | 10:1 |
Specific Gravity: | 1.13 |
Tensile Strength: | 985 psi |
Viscosity: | 542,000 |
Volume Resistivity: | 5.0e + 14 ohm-cm |
Working Time: | 8h @ 25 °C |