Dow DOWSIL™ SE 1700 W/C Thermally Conductive Adhesive Clear is a two-part non-flowing, heat cure, and high tensile strength adhesive. It is primarily used for sealing ceramic condensers, sealing PCB components, and as a bonding agent for key pad of PC. 1.1 kg Kit.
| Typical Use: | Used for sealing ceramic condensers, sealing PCB components, and as a bonding agent for key pad of PC. |
| Brand: | DOWSIL |
| Chemical Composition: | Polydimethylsiloxane adhesive |
| Color: | Clear |
| Components: | 2 part |
| Cure System: | Heat |
| Cure Time: | 30min @ 150 °C |
| Elongation: | 355% |
| Hardness: | 48 A |
| Mix Ratio: | 10:1 |
| Specific Gravity: | 1.13 |
| Tensile Strength: | 985 psi |
| Viscosity: | 542,000 |
| Volume Resistivity: | 5.0e + 14 ohm-cm |
| Working Time: | 8h @ 25 °C |