Dow DOWSIL™ EE-3200 Silicone Encapsulant Part B Black 0.5 kg Jar

Part number: EE-3200 PART B .5KG Manufacturer SKU: 4121013
Dow DOWSIL™ EE-3200 Silicone Encapsulant Part B Black 0.5 kg Jar
Quantity Price
1 $200.18 200.180000000 CAD New Limited Availability EE-3200 PART B .5KG
2-8 $143.13 143.130000000 CAD New Limited Availability EE-3200 PART B .5KG
9+ $134.12 134.120000000 CAD New Limited Availability EE-3200 PART B .5KG
Usually Ships in 2-3 Business Weeks. Subject to prior sales. Non-returnable product. Canceled orders may incur a fee at the supplier’s discretion. Product not sold online in Quebec.

Dow DOWSIL™ EE-3200 Low Stress Silicone Encapsulant is a two component, low viscosity encapsulant with a 1:1 mix ratio, good heat dissipation, and good thermal conductivity. Once thoroughly mixed, the mixture will cure to a flexible elastomer for the protection of electronic and electrical components. Part B, 0.5 kg Jar.

<p>Dow DOWSIL™ EE-3200 Low Stress Silicone Encapsulant is a two component, low viscosity encapsulant with a 1:1 mix ratio, good heat dissipation, and good thermal conductivity. Once thoroughly mixed, the mixture will cure to a flexible elastomer for the protection of electronic and electrical components. Part B, 0.5 kg Jar.</p>
Typical Use: Used as a low stress encapsulant to lessen internal stress generation, improve manufacturing speed, and fill small gaps on electronic devices. EE-3200 can be used on automotive electronics modules, junction boxes, and power conversion devices.
Brand: DOWSIL
Chemical Composition: Polydimethylsiloxane
Color: Black
Components: 2 part
Cure System: Room Temperature/Heat
Cure Time: 3h @ 25 °C; 20min @ 50 °C
Dielectric Strength: 350 V/m
Elongation: 340%
Flash Point: 98 °C
Hardness: 20 OO
Mix Ratio: 1:1
Specific Gravity: 1.48
Tensile Strength: 33 psi
Thermal Conductivity: 0.5 W/mK
Viscosity: 2,000
Volume Resistivity: 1e + 15 ohm-cm
Working Time: 30min @ 25 °C

 

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