ResinLab EP1026T2 Clear is a two component, room and elevated temperature curing, unfilled, epoxy adhesive paste that is used for rapid bonding of plastics, metal, and ceramics. It is semi-rigid, non-sagging, and resistant to salt spray, water, organic and inorganic solvents. 1:1 mix ratio. 50 mL Cartridge.
| Typical Use: | It was especially formulated to a 1:1 mix ratio for use in either MMD equipment or side-by-side dual cartridges for easy dispensing. |
| Chemical Composition: | Epoxy |
| Color: | Clear |
| Components: | 2 part |
| Cure System: | Room Temperature |
| Cure Time: | 24h |
| Dielectric Strength: | 410 V/mil |
| Elongation: | 3 to 5% |
| Flash Point: | >93.3 °C |
| Hardness: | 80 D |
| Mix Ratio: | 1:1 by volume |
| Service Temperature: | -40 to 130 °C |
| Specific Gravity: | Mixed: 1.16 |
| Tack Free Time: | 20 to 30min |
| Tensile Strength: | 7,000 psi |
| Viscosity: | Mixed: Paste |
| Volume Resistivity: | 8 x 10^14 ohm-cm |
| Working Time: | 3 to 5min |