ResinLab EP1026 Epoxy Clear is a two component, room and elevated temperature curing, unfilled adhesive that is used for bonding plastics, metal, and ceramics. It is semi-rigid, free flowing, and resistant to salt spray, water, and most organic and inorganic solvents. 50 mL Cartridge.
| Typical Use: | Designed for high speed bonding of metals, ceramics, and most plastics. |
| Chemical Composition: | Epoxy |
| Color: | Clear |
| Components: | 2 part |
| Cure System: | Room Temperature |
| Cure Time: | 24h @ room temperature |
| Dielectric Strength: | 410 V/mil |
| Elongation: | 10% to 20% @ break |
| Flash Point: | Part A: 252 °C; Part B: >93 °C |
| Hardness: | 85 D |
| Mix Ratio: | 1:1 |
| Service Temperature: | -40 to 90 °C |
| Shear Strength: | 2,500 |
| Specific Gravity: | Mixed: 1.14 |
| Tensile Strength: | 7,500 psi |
| Thermal Conductivity: | 0.185 W/mK |
| Viscosity: | Mixed: 15,500 |
| Volume Resistivity: | 8 x 10^14 ohm-cm |
| Working Time: | 3 to 5min |