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325 50 GRAM KIT 1 TO 1

Dynaloy 325 Epoxy Adhesive Silver 50 g Kit

 
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Description

Dynaloy 325 Epoxy Adhesive Silver is a two component, room temperature curing, thixotropic paste that is used to replace metal solder on heat sensitive components, print circuit boards, ground wires, and wave guide plumbing. It is self leveling and has good electric conductivity. 50 g Kit.

Dynaloy 325 Epoxy Adhesive Silver 50 g Kit

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Part Number 325 50 GRAM KIT 1 TO 1
Color Silver
Components 2 part
Full Cure Time 24h @ room temperature; 2h @ 60 °C; 15 to 20min @ 150 °C
Mix Ratio 1:1
Service Temperature -60 to 175 °C
Shear Strength PSI 1,200 to 2,500
Thermal Conductivity 25 x 10^-4 W/mK
Volume Resistivity Room Cured: 0.006 ohm-cm; Heat Cured: 0.003 ohm-cm
Working Time 1 to 2h @ room temperature
Applications include RFI and EMI shielding, chip bonding for discrete devices and hybrid circuits, connecting ground wires to components and making conductive lines, and connecting heat sensitive components to printed circuit boards.