Thermal Interface Materials – Adhesives, Encapsulants, Compounds or Greases, and Pads are used to dissipate heat in a wide range of electronic devices.  These materials consist of a base synthetic polymer system containing thermally conductive fillers.  The synthetic polymers may be epoxies, silicones or other materials and they may cure or not cure or may be pre-cured (pads).  Ellsworth Adhesives represents many of the world's leading manufacturers of Thermal Interface Materials, including Dow Corning, Henkel Loctite, Emerson and Cuming, and Resinlab.